wafer production 結果共2筆

Taiwan Semiconductor Manufacturing Company (TSMC) has announced that its Japan subsidiary, JASM, will construct a second wafer fabrication plant by the end of 2024. The plant is expected to be operational by the end of 2027. With support from the Japanese government, TSMC plans to begin production at its first JASM wafer fabrication plant in 2024, with a total investment exceeding US＄20 billion. The construction of the second plant is driven by increasing customer demand. The expansion aims to optimize JASM’s cost structure and supply chain efficiency, resulting in increased production. Once both plants are operational, JASM’s Kumamoto wafer fabrication plant will have a monthly capacity of over 100,000 12-inch wafers. The Japan fab will offer process technologies ranging from 40nm to 6nm, catering to automotive, industrial, consumer, and high-performance computing applications. TSMC also mentioned that capacity planning can be adjusted based on client requirements. The Kumamoto wafer plant is expected to create more than 3,400 high-tech professional jobs.

Explore the dynamics of Taiwan’s semiconductor industry as it gears up for significant growth in 2024, with insights from industry leaders and experts on global competition, TSMC’s strategic moves, and market trends.